| 注册类型 | 早鸟票（11月25日之前） | 全价票（11月25日之后） | |
|---|---|---|---|
| 标准注册（赠送一张十二岁以下儿童餐券，包含会议期间的午餐和晚餐） | 3400元 | 3900元 | |
| 学生注册 | 2000元 | 2200元 | |
| 国际注册（论文作者注册必须采用国际注册） | |||
| 标准注册 | 690美元 | 760美元 | |
| 学生注册 | 420美元 | 480美元 | |
| 简易注册（不提供餐饮） | 2200元 | 2400元 | |
| 简易学生注册（不提供餐饮） | 1400元 | 1600元 | |
| 团体注册 | |||
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注册方式: 请向以下账户转账，并发送团体参会人员信息（姓名，邮箱，单位，手机号码及发票信息）到benchcouncil@bafst.com邮箱。 在确认收到注册费用后，会议注册团队将核对团体参会人员信息并协助完成团体注册。 收款账户：北京本尺康舍信息科技研究院有限公司 开户行：中国建设银行北京右安门支行 账号：11001071600053009881 |
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| 团队5人至10人，享受9.5折优惠 | |||
| 团队11人至15人：享9折优惠 | |||
| 团队16人至20人，享受8.5折优惠 | |||
| 国内注册链接： | https://app.ic3i.com/fsevent/ficc2023/register/ | ||
| 国际注册（论文作者注册）链接： | https://eur.cvent.me/5qQEq | ||
| 关于退款政策：
1.如果在2023 年 10 月 31 日之前取消，则退款金额为 100%。 2.如果在2023 年 11 月 15 日之前取消，则退款金额为 80%。 3.2023 年 11 月 15日后不可退款。 4.如果注册者是唯一注册参加会议论文的作者，则不予退款。多篇论文不能共享同一个注册号。 |
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三亚湾红树林度假世界是占地400亩，建筑面积70万平方米的一 站式度假目的地综合体。度假世界拥有7座不同风格的酒店（木棉 酒店A/B、菩提酒店、皇后棕酒店、大王棕酒店、棕榈王国亲子主 题酒店、椰林酒店）。三亚湾红树林拥有包括“红树林招牌泰 餐厅”，“红树林烤鸭”等在内的几十家主题餐吧及酒吧，3.3万平方 米亚马逊丛林水乐园，4800平方米今日X书屋，5000平方米探险 王国，红树林奥特莱斯，1+X红树林影城，今日艺术汇，电影工坊， 陶艺吧等等，以及有多家世界顶级品牌入驻的15万平方米的红树 林室内商街。
地址：三亚市天涯区凤凰路155号 预定酒店（预订联系人刘云，手机（微信同号）：18515436835）椰林酒店标间（45平）含单早400元/天；含双早480元/天
大王棕酒店标间（53平）含单早480元/天；含双早530元/天
大王棕酒店套房（含双早，95平）：950元/天
机场/高铁机场站--酒店：10公里，约30元
大会共同主席:
李维萍, 中国民用航空飞行学院
Tao Tang, 香港浸会大学联合国际书院
Frank Werner, Institute of Mathematical Optimization, Otto-von-Guericke-University, German
程序委员会共同主席:
Christophe Cruz, Université de Bourgogne
张彦春，维多利达大学
高婉铃，中国科学院计算技术研究所
程序委员会主席：
Christophe Cruz, University de Bourgogne, France
Yanchun Zhang, Victoria University, Australia
Wanling Gao, ICT, Chinese Academy of Sciences, China
程序委员会副主席：
Jungang Xu, University of Chinese Academy of Sciences, China
Yucong Duan, Hainan University, China
IC 2023 领域主席
AI Algorithms
Hideyuki Takahashi, Department of Data Science, Faculty of Informatics, Tohoku Gakuin University, Japan
Faraz Hussain, Clarkson University, USA
Chunjie Luo, University of Chinese Academy of Science, China
AI Systems
Pengfei Chen, SUN YAT-SEN UNIVERSITY, China
Jason Jia, Amazon, USA
Xiaoguang Wang, University of Illinois Chicago, USA
AI for Ocean Science and Engineering
Guoqiang Zhong, Ocean University of China, China
Hui Yu, University of Portsmouth, UK
AI in Finance
Co-chairs：
Changyun Wang, Renmin University of China, China
Michael Guo, Durham University, UK
Program Co-Chairs：
Zhigang Qiu, Renmin University of China, China
Shinan Cao, University of International Business and Economics, China
AI for Education
John Impagliazzo, Hofstra University, USA
Xuesong Lu, East China Normal University, China
Stéphane Bressan, National University of Singapore, Singapore
AI for Law
Minghui Xiong, ZJU Law & AI Laboratory, Zhejiang University, China
Bart Verheij, Department of Artificial Intelligence, University of Groningen, the Netherlands
AI for Materials Science and Engineering
Siqi Shi, School of Materials Science and Engineering, Shanghai University, China
Turab Lookma, AiMaterials Research LLC, Santa Fe, USA
Yue Liu, School of Computer Engineering and Science, Shanghai University, China
AI for Sciences
Tao Zhou, Institute of Computational Mathematics and Scientific/Engineering Computing, Academy of Mathematics and Systems Sciences, Chinese Academy of Sciences, China
Weile Jia, Institute of Computing Technology, Chinese Academy of Sciences, China
AI for Civil Aviation
Lin Zou, Civil Aviation Flight University of China, China
AI for Medicine
Co-chairs：
Zhenchang Wang, Beijing Friendship Hospital, Capital Medical University, China
Jie Lu, Xuanwu Hospital, Capital Medical University, China
Jinlyu Sun, Peking Union Medical College Hospital, China
Vice-Chair：
Zhifei Zhang, Capital Medical University, China
AI for Space Science and Engineering
Ziming Zou, National Space Science Center, Chinese Academy of Sciences, China
Liming Song, Institute of High Energy Physics, Chinese Academy of Sciences, China
AI for High Energy Physics
Co-chairs：
Yaodong Cheng, Institute of High Energy Physics, Chinese Academy of Sciences, China
Yaquan Fang, Institute of High Energy Physics, Chinese Academy of Sciences, China
Program Co-Chairs：
Xinchou Lou, University of Texas at Dallas, Dallas & Institute of High Energy Physics (IHEP), China
AI and Security
Bo Luo, University of Kansas, US
Yu Wen, Institute of Information Engineering, Chinese Academy of Sciences, China
宣传主席：
Fei Teng, Southwest Jiaotong University, China
Zheng Yuan, Lecturer, King's College London, UK
Roy Lee, Singapore University of Technology and Design, Singapore
Ming Gao, East China Normal University, China
Yuan Cheng, Fudan University, China
Juan Li, Central South University, China
Tianwen Xu, Zhejiang University, China
Yicheng Liao, Zhejiang University, China
Xiao Chi, Zhejiang University, China
Zhengwei Yang, School of Computer Engineering and Science, Shanghai University, Shanghai, China
Han Lv, Beijing Friendship Hospital, Capital Medical University, China
Xiaoyan Hu, National Space Science Center, Chinese Academy of Sciences, China
Yanjie Fu, University of Central Florida, USA
Weiwei Tang, National Space Science Center, Chinese Academy of Sciences, China
Pengyang Wang, University of Macau, China
Haijun Yang, Shanghai Jiao Tong University (SJTU), Shanghai, China
Xingtao Huang, Shandong University (SDU), Qingdao, China
Huilin Qu, the European Organization for Nuclear Research (CERN), Geneva
技术委员会主席：
AI Algorithms
Diego Oliva, University of Guadalajara, Guadalajara, Mexico
Yogendra Arya, J.C. Bose University of Science and Technology, India
Nazar Khan, Punjab University, Pakistan
Yingjie Shi, Beijing Institute of Fashion Technology, China
Sansanee Auephanwiriyakul, Chiang Mai University, Thailand
Xiexue Zhou, Max Planck Institute of Biochemistry, Germany
Zihan Jiang, Huawei, China
AI Systems
Xiaoguang Wang, University of Illinois Chicago, USA
Pengfei Zheng, Huawei Ltd., China
Yushan Su, Princeton University, USA
Runan Wang, Imperial College London, UK
Jindal, Anshul, Technical University of Munich, Germany
Hui Dou, Anhui University, China
Saiyu Qi, Xi’an Jiaotong University, China
Wuxia Jin, Xi’an Jiaotong University, China
Chuan Chen, Sun Yat-sen University, China
Shajulin Benedict, Indian Institute of Information Technology, India
Vishvak Murahari, Princeton University, USA
AI for Ocean Science and Engineering
Partha Pratim Roy, Institute of Technology Roorkee, India
Rachid Hedjam, Sultan Qaboos University, Oman
Xin Li, China University of Petroleum (East China), China
Zhimin Wang, Ocean University of China, China
Chi Zhang, Ocean University of China, China
AI in Finance
George Alexandridis，Reading University, UK
Haoyu Gao, Renmin University of China
Yi Huang, Fudan University, China
Fuwei Jiang, Central University of Finance and Economics, China
Dimitris Petmezas，Durham University, UK
Georgios Sermpinis，Glasgow University, UK
Yanmei Sun, University of International Business and Economics, China
Evangelos Vagenas-Nanos, Glasgow University, UK
Quan Wen, Georgetown University, USA
Ke Wu, Renmin University of China, China
Teng Zhong, University of International Business and Economics, China
Dexin Zhou, CUNY Baruch College, USA
Xiaoneng Zhu, Shanghai University of Finance and Economics, China
Yifeng Zhu, Central University of Finance and Economics, China
AI for Education
Yunshi Lan, East China Normal University, China
Shenggen Ju, Sichuan University, China
Zhenya Huang, University of Science and Technology of China, China
Tiancheng Zhang, Northeastern University, China
Zheng Yuan, King’s College London, UK
Thomas Heinis, Imperial College London, UK
Roy Lee, Singapore University of Technology and Design, Singapore
Sadegh Nobari, Chief Information Officer, Startbahn, Japan
Alison Clear, Eastern Institute of Technology, New Zealand
Tony Clear, Auckland University of Technology, New Zealand
Judith Gal-Ezer, Open University of Israel, Israel
Natalie Kiesler, DIPF | Leibniz-Institute, German
AI for Law
Michal Araszkiewiz, Jagiellonian University, Poland
Wenjing Du, East China University of Political Science and Law, China
Juan Li, Central South University, China
Reka Markovich, University of Luxemburg, Luxemburg
Matthias Grabmair, Technical University of Munich, Germany
Monica Palmirani, University of Bologna, Italy
Bin Wei, Zhejiang University, China
Heng Zheng, University of Illinois Urbana-Champaign, USA
AI for Materials Science and Engineering
Dezhen Xue, State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, China
Jinjin Li,Department of Micro/Nano Electronics, Shanghai Jiao Tong University, China
Lei Li, Department of Materials Science and Engineering, Southern University of Science and Technology, China
Maxim Avdeev, Australian Nuclear Science and Technology Organization, School of Chemistry, The University of Sydney, Australia
Yanjing Su, Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, China
Zhi Wei Seh, Institute of Materials Research and Engineering, A*STAR, Singapore
Zhijun Fang, School of Computer Science and Technology, Donghua University, China
Zijian Hong, School of Materials Science and Engineering, Zhejiang University, China
AI for Sciences
Guihua Shan, Computer Network Information Center, Chinese Academy of Sciences, China
Zhiqin Xu, Shanghai Jiao Tong University, China
Chi Zhou, Shenzhen University, China
Lijun Liu, Osaka University, Osaka, Japan
Di Fang, University of California, Berkeley, US
Xiaojie Wu, Bytedance Inc. US
Tong Zhao, Institute of Computing Technology, Chinese Academy of Sciences, China
AI for Civil Aviation
Michael Schultz, Institute of Flight Systems, Bundeswehr University Munich, 85577 Neubiberg, Germany
Paolo Tortora, Dipartimento di Ingegneria Industriale, Alma Mater Studiorum Università di Bologna, Bologna, Italy
Carlos E.S. Cesnik, Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708, USA
Michael I. Friswell, Faculty of Science and Engineering, Swansea University, Swansea SA1 8EN, UK
Song Fu, School of Aerospace Engineering, Tsinghua University, Beijing 100084, China
Jae-Hung Han, Department of Aerospace Engineering, KAIST, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Korea
Jacques Periaux , Full Research Professor on Numerical Methods in Engineering at CIMNE/UPC, Barcelona, Spain
Domenico Accardo, DII—Department of Industrial Engineering, University of Naples Federico II, Piazzale Vincenzo Tecchio, 80, Naples, Italy
Rafic M. Ajaj, Department of Aerospace Engineering, Khalifa University, Abu Dhabi 127788, United Arab Emirate
Gang Chen, State Key Laboratory for Strength and Vibration of Mechanical Structures, School of Aerospace Engineering, Xi'an Jiaotong University, Xi'an 710049, China
Mou Chen, College of Automation Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Wing Chiu, Department of Mechanical and Aerospace Engineering, Monash University, Room G27A, 17 College Walk (Building 31), Clayton Campus, Wellington Road, Clayton, VIC 3800, Australia
AI for Medicine
Han Lv, Beijing Friendship Hospital, Capital Medical University, China
Peng Wang, Beijing Ditan Hospital, Capital Medical University, China
Chaodong Wang, Xuanwu Hospital, Capital Medical University, China
Longxin Xiong, Nanchang Ninth Hospital, China
Mingzhu Zhang, Beijing Tongren Hospital, Capital Medical University, China
Yi Li, Peking Union Medical College Hospital, China
Shenhai Wei, The First Hospital of Tsinghua University, China
Hongxu Yang, GE Healthcare, Netherlands
Xiaohong Liu, Shanghai Jiao Tong University, China
Bingbin Yu, German Research Center for Artificial Intelligence-Robotic Innovation Center, Germany
Menghan Hu, East China Normal University, China
Shuo Li, Case Western Reserve University, USA
Tao Tan, Faculty of Applied Sciences, Macao Polytechnic University
Yue Wu, Shanghai Ninth People's Hospital, Shanghai JiaoTong University School of Medicine, China
Siuly Siuly, Victoria University, Australia
Enamul Kabir, University of Southern Queensland, Australia
Muhammad Tariq Sadiq, University of Brighton, UK
Smith K. Khare, Aarhus University, Denmark
Mohammed Diykh, University of Thi-Qar, College of Education for Pure Science, Iraq
Supriya Angra, Torrens University, Australia
Abdulkadir ŞENGÜR, Firat University, Turkey
Varun Bajaj, PDPM-Indian Institute of Technology, Design and Manufacturing, India
Ömer Faruk ALÇİN, Malatya Turgut Ozal University, Turkey
K. Venkatachalam, University of Hradec Králové, Hradec Králové, Czech Republic
Ivan Lee, TheUniversity of South Australia, Australia
Feng Xia, RMIT University, Australia
Zhiguo Gong, The University of Macau, China
Hong Yang, Guangzhou University, China
Qian Zhou, Nanjing Univerrsity of Posts and Telecommunications, China
Wenjun Tan, Northeastern University, China
AI for Space Science and Engineering
Zongcheng Ling, Shandong University, China
Yanjie Fu, University of Central Florida, USA
Jiajia Liu, University of Science and Technology of China, China
Xiaoxi He, University of Macau, China
AI for High Energy Physics
Xinchou Lou, University of Texas at Dallas, Dallas & Institute of High Energy Physics (IHEP), Beijing, China
Haijun Yang, Shanghai Jiao Tong University (SJTU), Shanghai, China
Xingtao Huang, Shandong University (SDU), Qingdao, China
Huilin Qu, the European Organization for Nuclear Research (CERN), Geneva
Bruce Mellado, University of the Witwatersrand (WIS), Johannesburg
Fabio Hernandez, Computing Centre, National institute of nuclear and particle physics (IN2P3), Lyon
AI and Security
Yanwei Liu, Institute of Information Engineering, Chinese Academy of Sciences
Hongjia Li, Institute of Information Engineering, Chinese Academy of Sciences
Zhiqiang Xu, Jiangxi University of Science and Technology
Liwei Chen, Institute of Information Engineering, Chinese Academy of Sciences
Yanni Han, Institute of Information Engineering, Chinese Academy of Sciences
Duohe Ma, Institute of Information Engineering, Chinese Academy of Sciences
参会补助提供给已注册参加会议的申请人。FICC会议将于12月3日至6日在中国海南三亚举行，所有注册者均可报名申请参会补助。由于补助金总额是固定金额，因此数量有限，并且只能支付您的一部分费用。
参会补助设置两个级别：不多于20 人，可获得 2100 元人民币（300 美元）补助；不多于100 人可获得 700 元人民币（100 美元）。 旅行补助金的最终获奖名单将在会议宴会期间公布。另外，已经申请家庭餐券的个人不能再申请参会补助。
有关参会补助的重要信息：
如果您想申请补助金，请联系student.travel.grant.bench@gmail.com。
使用主题行“FICC 2023 旅行补助金申请”。 旅费补助申请（单个合并的 pdf 文件）应包括：
Travel Grant 能够支持的发票类型：住宿、餐饮、交通
发票抬头主体：北京本尺康舍信息科技研究院有限公司，纳税人识别号：91110108597708879A
BenchCouncil推出了Top100计划，旨在认可芯片、人工智能、开源、评估和基准测试领域的前100个成就。这些成就被称为Chip100、AI100、Open100和Bench100。因此，我们编制了四个排名的年度和百年版本，可以在 https://www.benchcouncil.org/evaluation/上公开访问。这些排名在全球学术界和工业界引起了极大的兴趣、评论和建议。
对于被选入BenchCouncil Top 100成就排名榜单（AI100, Chip100, Open100, Bench100）年度版本的人员：
学术界 免费服务:
工业界 免费服务:
免费注册链接：https://eur.cvent.me/eAxmP
此外，我们为被选入Top 100成就排名榜单（AI100, Chip100, Open100, Bench100）的学术或工业机构提供升级服务。注册升级服务的机构可以在FICC 2023会议上享受额外的福利。注册数量、主题演讲时长和展位空间的数量将根据您是来自学术界还是工业界而有所不同。我们也可以根据要求提供定制服务。
如您需要注册升级服务，请将对应款项转账到如下银行账户.
另外, 请发送邮件到 benchcouncil.evaluation@gmail.com. 你也可以使用如下链接：https://eur.cvent.me/eAxmP 进行升级.
学术机构升级服务：
工业界升级服务：
为了避免错过重要的成就，BenchCouncil正在征集人工智能、芯片、开源、基准测试和评估等领域的成就。经过初步评估后，成就的提交者将有机会在FICC 2023会议上展示或展示他们的工作，并有机会进入最终排名。
十大好处
1. 提交的成就将被包括在BenchCouncil的年度成就报告中，并将被引用。提交者需要提供有效的引用格式，包括论文出版物、代码仓库等。编制的年度成就报告将正式发表在BenchCouncil Transactions上。
2. 成就的提交者将获得年度成就英文证书。例如，芯片类别的证书将被命名为“2023年BenchCouncil芯片成就选择证书”。证书将显示个人和机构名称。
3. 成就将在BenchCouncil成就评估的官方英文网页上展示 (https://www.benchcouncil.org/evaluation/).
4. BenchCouncil官方英文网页将提供成就的链接。提交者应确保链接内容真实、非欺骗性和准确性。
5. 提交者将有机会参加四个会议：Chips 2023、OpenCS 2023、Bench 2023和IC 2023。他们将有机会与国际同行进行广泛交流。
6. 选定的成就将在会议场地展示。具体时间段（通常不超过一天）和地点需要与会议组织者协调。
7. 成就的提交者有机会在会议上展示他们的工作，具体安排将根据进一步评估和会议组织者的安排而定。
8. 被邀请在会议上展示的优秀成就可能有机会在委员会评估和同行认可后，被纳入年度世界贡献版（最终版本）。委员会为芯片、人工智能、开源、基准与评价每个领域预留了20个名额。
9. 经受住时间考验的典范成就有机会被纳入世纪版本的世界贡献版（公开征集意见版）。
10. 成就的提交者可以申请差旅资助。
征集成果的范围：
芯片领域（范围包括但不限于：系统设计，逻辑设计，物理设计，时序设计，验证与仿真，模拟器，辅助设计工具，超导、量子等新兴芯片，新兴加速器，半导体材料，光刻技术，电路，封装技术）。
人工智能（范围包括但不限于：机器学习，强化学习，自然语言处理，图像分析，视频分析，数据挖掘，推荐系统，知识表示和推理，医学图像处理，多模态信息融合，群体智能，智能机器人和系统，智能控制，智慧医疗，人工智能与天文学，人工智能与高能物理，人工智能与空间科学，人工智能与交通，人工智能与海洋，人工智能与安全，人工智能与法学，人工智能与金融，人工智能与传统工业，人工智能伦理与治理，人工智能与大数据，人工智能与材料，人工智能与民航应用，人工智能与商业管理）。
开源（范围包括但不限于：芯片、操作系统、容器化和虚拟化、编译器、数据管理、网络、编程语言和编译器、系统和框架、基本库、监控和优化工具、大数据、AI、云计算、HPC、区块链、LLM、自动驾驶、数字孪生、数联网、隐私和安全、数据集、教育）。
测试基准与评价（范围包括但不限于：计量经济学、临床医学评估、药物评价、商业和金融基准、人工智能评价、HPC基准、数据库基准、内存基准、网络基准、硬件与磁盘基准、图基准、人力资源评价、教育学评价和指标体系建立）。
成果征集过程：
成果评价标准：
在被选中后，至少需要有一个注册会议。
请将款项转入以下银行账户。
此外，您也可以通过以下注册链接使用信用卡付款： https://eur.cvent.me/5qQEq
1. FICC 2023的1个标准注册。
此外，我们为进入Top 100成就排名榜单 (AI100, Chip100, Open100, Bench100).的学术或工业机构提供升级服务（注册链接为https://eur.cvent.me/k85BK）。注册升级服务的机构可以在FICC 2023会议上享受额外的福利。注册人数、主题演讲时长和展位空间的数量将根据您是来自学术界还是工业界而有所不同。此外，我们还可根据要求提供定制服务。
学术机构升级服务：
工业界升级服务：